Elevating low-emissivity film for lower thermal transmittance with heat flux sensors

 

A team of researchers from the University of California (Rui Koua,Ying Zhonga, Jeongmin Kimb, Qingyang Wang, Meng Wanga, Renkun Chen, and Yu Qiao) has recently published a new paper about the thermal improvement of windows. The paper is published in the journal Energy and Buildings.

This paper investigates the effects of elevating a low emissivity (low-E) film from a glass pane, which should lower heat conduction and radiative thermal transfer due to the resulting insulating air gap.  This technique is important to retrofit single pane windows, as 30-40% of windows in the US are single pane.  To assess the thermal transmittance, greenTEG’s gSKIN® XI heat flux sensors were used to measure the heat flux. The study showed that thermal resistance could be reduced from around 6 W/(m2K) to less than 2.8 W/(m2K). The U-value can be further improved by increasing the air gap size or reducing the emissivity of the film.

Our sensors have a wide range of applications for research purposes, as the heat flux is the best way to measure thermal effects. They can add significant value to many experiment settings where one need to accurately measure thermal flows. For more information about the most common applications of our heat sensors for research purposes, please download our guide.

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